Paper
10 April 2014 Crack identification based on thin-film full-bridge strain sensors
Shue-Ting E. Tung, Yao Yao, Branko Glisic
Author Affiliations +
Abstract
A sensing sheet based on large-area electronics consists of a dense array of discrete short-gauge sensor units, integrated circuits for collecting, analyzing and communicating data, and a flexible photovoltaic system that serves as both a power harvester and a protective layer. We investigated the sensitivity of thin-film full-bridge strain sensors to cracks, and the effect of crack position with respect to the sensor. In general, the results of this research show that full-bridge strain sensors can successfully detect and characterize cracks in structural materials and are therefore good candidates to utilize in a sensing sheet.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shue-Ting E. Tung, Yao Yao, and Branko Glisic "Crack identification based on thin-film full-bridge strain sensors", Proc. SPIE 9061, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2014, 90610Y (10 April 2014); https://doi.org/10.1117/12.2045426
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Cited by 1 scholarly publication.
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KEYWORDS
Sensors

Fiber optics sensors

Calibration

Sensing systems

Structural health monitoring

Electronics

Environmental sensing

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