Paper
2 May 2014 Uniform fabrication of thick SU-8 patterns on small-sized wafers for micro-optics applications
S. Abada, B. Reig, E. Daran, JB Doucet, T. Camps, S. Charlot, V. Bardinal
Author Affiliations +
Abstract
This paper reports on an alternative method for precise and uniform fabrication of 100μm-thick SU-8 microstructures on small-sized or non-circular samples. Standard spin-coating of high-viscosity resists is indeed known to induce large edge beads, leading to an air gap between the mask and the SU-8 photo-resist surface during UV photolithography. This results in a non uniform thickness deposition and in a poor pattern definition. This problem becomes highly critical in the case of small-sized samples. To overcome it, we have developed a soft thermal imprint method based on the use of a nano-imprint equipment and applicable whatever sample fragility, shape and size (from 2cm to 6 inches). After final photolithography, the SU8 pattern thickness variation profile is measured. Thickness uniformity is improved from 30% to 5% with a 5μm maximal deviation to the target value over 2cm-long samples.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Abada, B. Reig, E. Daran, JB Doucet, T. Camps, S. Charlot, and V. Bardinal "Uniform fabrication of thick SU-8 patterns on small-sized wafers for micro-optics applications", Proc. SPIE 9130, Micro-Optics 2014, 91300R (2 May 2014); https://doi.org/10.1117/12.2052451
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Printing

Semiconducting wafers

Silicon

Optical lithography

Ultraviolet radiation

Vertical cavity surface emitting lasers

Micro optics

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