Survey of thermography in electronics inspection

Sheng-Jen Hsieh

doi:10.1117/12.2053134

21 May 2014 Survey of thermography in electronics inspection

Sheng-Jen Hsieh

Proceedings Volume 9105, Thermosense: Thermal Infrared Applications XXXVI; 91050P (2014) https://doi.org/10.1117/12.2053134
Event: SPIE Sensing Technology + Applications, 2014, Baltimore, MD, United States

Abstract

This paper reviews applications of infrared thermal signature techniques to detection of faults and defects on electronics boards. Issues essential to the successful application of infrared techniques to electronics manufacturing and circuit card maintenance are investigated. These issues include basic know-how such as scanning time interval and screening variables; a description of the types of defects and faults these methods have been used to detect; and a comparison of infrared thermal imaging and other detection means such as X-ray and functional testers. The paper concludes with a summary of potential problems and remedies. Future directions include design for infrared diagnosis and development of integrated testing techniques for detection and root-cause analysis.

Citation Download Citation

Sheng-Jen Hsieh "Survey of thermography in electronics inspection", Proc. SPIE 9105, Thermosense: Thermal Infrared Applications XXXVI, 91050P (21 May 2014); https://doi.org/10.1117/12.2053134

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