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Proceedings Article

Three dimensional profile measurement using multi-channel detector MVM-SEM

[+] Author Affiliations
Makoto Yoshikawa, Sumito Harada, Keisuke Ito, Tsutomu Murakawa, Soichi Shida, Jun Matsumoto, Takayuki Nakamura

Advantest Corp. (Japan)

Proc. SPIE 9256, Photomask and Next-Generation Lithography Mask Technology XXI, 92560G (July 28, 2014); doi:10.1117/12.2064944
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From Conference Volume 9256

  • Photomask and Next-Generation Lithography Mask Technology XXI
  • Kokoro Kato
  • Yokohama, Japan | April 15, 2014

abstract

In next generation lithography (NGL) for the 1x nm node and beyond, the three dimensional (3D) shape measurements such as side wall angle (SWA) and height of feature on photomask become more critical for the process control. Until today, AFM (Atomic Force Microscope), X-SEM (cross-section Scanning Electron Microscope) and TEM (Transmission Electron Microscope) tools are normally used for 3D measurements, however, these techniques require time-consuming preparation and observation. And both X-SEM and TEM are destructive measurement techniques. This paper presents a technology for quick and non-destructive 3D shape analysis using multi-channel detector MVM-SEM (Multi Vision Metrology SEM), and also reports its accuracy and precision. © (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

Makoto Yoshikawa ; Sumito Harada ; Keisuke Ito ; Tsutomu Murakawa ; Soichi Shida, et al.
" Three dimensional profile measurement using multi-channel detector MVM-SEM ", Proc. SPIE 9256, Photomask and Next-Generation Lithography Mask Technology XXI, 92560G (July 28, 2014); doi:10.1117/12.2064944; http://dx.doi.org/10.1117/12.2064944


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