Paper
4 March 2015 Capability enhancement in compact digital holographic microscopy
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Proceedings Volume 9302, International Conference on Experimental Mechanics 2014; 93020I (2015) https://doi.org/10.1117/12.2081128
Event: International Conference on Experimental Mechanics 2014, 2014, Singapore, Singapore
Abstract
A compact reflection digital holographic microscopy (DHM) system integrated with the light source and optical interferometer is developed for 3D topographic characterization and real-time dynamic inspection for Microelectromechanical systems (MEMS). Capability enhancement methods in lateral resolution, axial resolving range and large field of view for the compact DHM system are presented. To enhance the lateral resolution, the numerical aperture of a reflection DHM system is analyzed and optimum designed. To enhance the axial resolving range, dual wavelengths are used to extend the measuring range. To enable the large field of view, stitching of the measurement results is developed in the user-friendly software. Results from surfaces structures on silicon wafer, micro-optics on fused silica and dynamic inspection of MEMS structures demonstrate applications of this compact reflection digital holographic microscope for technical inspection in material science.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Weijuan Qu, Yongfu Wen, Zhaomin Wang, Fang Yang, and Anand Asundi "Capability enhancement in compact digital holographic microscopy", Proc. SPIE 9302, International Conference on Experimental Mechanics 2014, 93020I (4 March 2015); https://doi.org/10.1117/12.2081128
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KEYWORDS
Digital holography

Holography

Reflection

Microscopy

Inspection

Microelectromechanical systems

Charge-coupled devices

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