Research on resistance properties of conductive layer materials of microchannel plate film dynode

Ling-ling Peng; Qingduo Duanmu; Ji-kai Yang; Guo-zheng Wang

doi:10.1117/12.2175993

5 March 2015 Research on resistance properties of conductive layer materials of microchannel plate film dynode

Ling-ling Peng, Qingduo Duanmu, Ji-kai Yang, Guo-zheng Wang

Proceedings Volume 9521, Selected Papers from Conferences of the Photoelectronic Technology Committee of the Chinese Society of Astronautics 2014, Part I; 952110 (2015) https://doi.org/10.1117/12.2175993
Event: Selected Proceedings of the Photoelectronic Technology Committee Conferences held August-October 2014, 2014, China, China

Abstract

Silicon Microchannel Plate（MCP）is a new image multiplier devices based semiconductor process technology. Compared with the traditional glass MCP, Silicon MCP has an advantage in technology that the dynode materials and the substrate materials are separate. At the same time, the dynode preparation process and the microchannel arrays are also separate. Two different dynode conductive layer films are prepared: polysilicon conductive films prepared by low pressure chemical vapor deposition (LPCVD) and AZO thin films coated by atomic layer deposition (ALD). The conductive films coated by ALD are superior to dynode conductive films prepared by LPCVD. By comparing the resistivity of conductive polysilicon thin film and AZO thin film of different Al concentrations doped, AZO thin film of different Al concentrations doped is a more suitable conductive layer dynode material to satisfy the MCP conductive layer resistivity requirements.

Citation Download Citation

Ling-ling Peng, Qingduo Duanmu, Ji-kai Yang, and Guo-zheng Wang "Research on resistance properties of conductive layer materials of microchannel plate film dynode ", Proc. SPIE 9521, Selected Papers from Conferences of the Photoelectronic Technology Committee of the Chinese Society of Astronautics 2014, Part I, 952110 (5 March 2015); https://doi.org/10.1117/12.2175993

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