Paper
16 March 2015 Analysis of shot noise limitations due to absorption count in EUV resists
Suchit Bhattarai, Weilun Chao, Shaul Aloni, Andrew R. Neureuther, Patrick P. Naulleau
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Abstract
Both fundamental measurements of resist exposure events and measurements of line-edge roughness for similar exposure latitude images for e-beam and EUV patterning tools have been used to assess the relative role of exposure shot-noise in lithographic performance. Electron energy loss spectroscopy (EELS) has been performed to quantify the probability of absorption of 100 keV electrons in two commercially available EUV resists. About 1/3 of the incident electrons lose at least 2 eV in the materials and this absorption probability is larger than that for EUV photons in the two modern EUV resists. Exposure event count densities between EUV and e-beam differ by 11-13%, which results in an expected difference in the variation in exposure shot noise of only 6%. With matched image exposure latitudes and accounting for EUV mask LER contribution the measured LER distributions indicate a high (76% and 94%) confidence that EUV resist performance is currently not dominated by exposure event counts for two leading chemically amplified EUV resists.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Suchit Bhattarai, Weilun Chao, Shaul Aloni, Andrew R. Neureuther, and Patrick P. Naulleau "Analysis of shot noise limitations due to absorption count in EUV resists", Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 942209 (16 March 2015); https://doi.org/10.1117/12.2087303
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Cited by 6 scholarly publications.
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KEYWORDS
Line edge roughness

Extreme ultraviolet

Absorption

Extreme ultraviolet lithography

Electron beam lithography

Plasmons

Lithography

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