Paper
3 April 2015 1060-nm VCSEL-based parallel-optical modules for optical interconnects
N. Nishimura, K. Nagashima, T. Kise, A. F. Rizky, T. Uemura, Y. Nekado, Y. Ishikawa, H. Nasu
Author Affiliations +
Proceedings Volume 9368, Optical Interconnects XV; 93680A (2015) https://doi.org/10.1117/12.2078757
Event: SPIE OPTO, 2015, San Francisco, California, United States
Abstract
The capability of mounting a parallel-optical module onto a PCB through solder-reflow process contributes to reduce the number of piece parts, simplify its assembly process, and minimize a foot print for both AOC and on-board applications. We introduce solder-reflow-capable parallel-optical modules employing 1060-nm InGaAs/GaAs VCSEL which leads to the advantages of realizing wider modulation bandwidth, longer transmission distance, and higher reliability. We demonstrate 4-channel parallel optical link performance operated at a bit stream of 28 Gb/s 231-1 PRBS for each channel and transmitted through a 50-m-core MMF beyond 500 m. We also introduce a new mounting technology of paralleloptical module to realize maintaining good coupling and robust electrical connection during solder-reflow process between an optical module and a polymer-waveguide-embedded PCB.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
N. Nishimura, K. Nagashima, T. Kise, A. F. Rizky, T. Uemura, Y. Nekado, Y. Ishikawa, and H. Nasu "1060-nm VCSEL-based parallel-optical modules for optical interconnects", Proc. SPIE 9368, Optical Interconnects XV, 93680A (3 April 2015); https://doi.org/10.1117/12.2078757
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KEYWORDS
Vertical cavity surface emitting lasers

Optical interconnects

Optical mounts

Polymers

Interfaces

Modulation

Photography

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