Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method

Chi Hwan Lee; Dong Rip Kim; Xiaolin Zheng

doi:10.1117/12.2178057

1 June 2015 Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method

Chi Hwan Lee, Dong Rip Kim, Xiaolin Zheng

Author Affiliations +

Proceedings Volume 9467, Micro- and Nanotechnology Sensors, Systems, and Applications VII; 94670B (2015) https://doi.org/10.1117/12.2178057
Event: SPIE Defense + Security, 2015, Baltimore, MD, United States

Abstract

We report a simple, versatile, and wafer-scale water-assisted transfer printing method (WTP) that enables the transfer of nanowire devices onto diverse nonconventional substrates that were not easily accessible before, such as paper, plastics, tapes, glass, polydimethylsiloxane (PDMS), aluminum foil, and ultrathin polymer substrates. The WTP method relies on the phenomenon of water penetrating into the interface between Ni and SiO₂. The transfer yield is nearly 100%, and the transferred devices, including NW resistors, diodes, and field effect transistors, maintain their original geometries and electronic properties with high fidelity.

Citation Download Citation

Chi Hwan Lee, Dong Rip Kim, and Xiaolin Zheng "Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method", Proc. SPIE 9467, Micro- and Nanotechnology Sensors, Systems, and Applications VII, 94670B (1 June 2015); https://doi.org/10.1117/12.2178057

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