The method of quartz damage recovery in the photomask repair process

Hoon Namkung; MunSik Kim; EuiSang Park; HoYong Jung; SangPyo Kim; DongGyu Yim

doi:10.1117/12.2193081

9 July 2015 The method of quartz damage recovery in the photomask repair process

Hoon Namkung, MunSik Kim, EuiSang Park, HoYong Jung, SangPyo Kim, DongGyu Yim

Proceedings Volume 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII; 965806 (2015) https://doi.org/10.1117/12.2193081
Event: Photomask Japan 2015, 2015, Yokohama, Japan

Abstract

As the pattern size became gradually smaller, the defect detectability of the photomask inspection tool was more improved. For these reasons, we have to repair various defects more precisely. By improving the mask yield through the repair process, we can reduce the cost of mask fabrication. In this study, we studied the defect called quartz damage which distorts the AIMSTM (Arial Image Measurement System) intensity of the repaired pattern and causes the scrap of the photomask. The quartz damage is generally observed when the abnormal defects like particles were repaired in the poor repairing condition. The quartz damage occasionally results in repair errors and affects the AIMS intensity. Currently there is no clear solution for recovering the quartz damage. As a result, it is very difficult to get the high quality photomask if the quartz damage is generated on the photomask. Therefore, it is important to find a method of recovering the quartz damage for producing the high quality photomask. In this paper, we demonstrated that the quartz damage can be recovered through the TEOS (Tetraethoxysilane) gas deposition. Also we investigated the effect on the recovery of the quartz damage of various parameters such as the type and the depth of the quartz damage as well as the repair conditions of the TEOS gas deposition.

Citation Download Citation

Hoon Namkung, MunSik Kim, EuiSang Park, HoYong Jung, SangPyo Kim, and DongGyu Yim "The method of quartz damage recovery in the photomask repair process", Proc. SPIE 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 965806 (9 July 2015); https://doi.org/10.1117/12.2193081

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KEYWORDS

Quartz

Photomasks

Critical dimension metrology

Distortion

Light scattering

Silica

Optical lithography

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