Paper
9 July 2015 EUV scanner printability evaluation of natural blank defects detected by actinic blank inspection
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Abstract
In this study, on-wafer printability test results of native blank defects on an EUV reticle, previously detected on the ABI (Actinic blank inspection) tool, were interpreted with on-mask analysis. One of the main factors that affects printability is the relative defect position to the absorber pattern. The ABI tool has been used for this purpose, by means of on-mask review. Subsequently, by removing covered defects (blank defects which are covered with absorber pattern), a clear relationship between DSI (ABI defect signal intensity) and printability was confirmed. By considering a relationship between relative defect position and printability precisely, a tentative printability threshold was defined with DSI. This result suggests that DSI has valuable information to define printability threshold, and shows significance of ABI inspection.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Noriaki Takagi, Hidehiro Watanabe, Dieter Van den Heuvel, Rik Jonckheere, and Emily Gallagher "EUV scanner printability evaluation of natural blank defects detected by actinic blank inspection", Proc. SPIE 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 96580F (9 July 2015); https://doi.org/10.1117/12.2197622
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Cited by 4 scholarly publications.
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KEYWORDS
Inspection

Photomasks

Semiconducting wafers

Extreme ultraviolet lithography

Defect detection

Scanners

Printing

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