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Proceedings Article

Low-stress silicon cladding made by pulsed-ion-assisted evaporation

[+] Author Affiliations
David A. Sheikh

ZeCoat Corp. (United States)

Proc. SPIE 9574, Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems II, 95740C (September 2, 2015); doi:10.1117/12.2191445
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From Conference Volume 9574

  • Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems II
  • Matthias Krödel; Joseph L. Robichaud; William A. Goodman
  • San Diego, California, United States | August 09, 2015

abstract

A low-stress, polishable, silicon (Si) cladding process for lightweight mirrors is presented. The cladding process is based on the thermal evaporation of silicon in the presence of low-energy argon ions. The process utilizes an ion bombardment technique whereby the coating stress of a silicon film is manipulated periodically from compressive to tensile in order to achieve a low net stress for the complete layer. A Si cladding with little intrinsic stress is desirable to minimize bending that would otherwise distort the figure of very lightweight mirrors. The process has yielded silicon claddings up to 100-microns thick, with less than 85 MPa of compressive stress. This polishable Si cladding was specifically designed for silicon carbide mirror substrates, however, it is also suitable for graphite composite, beryllium, and aluminum mirror substrates, which may be difficult or impossible to polish to sufficient mirror quality without a specialized coating. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

David A. Sheikh
" Low-stress silicon cladding made by pulsed-ion-assisted evaporation ", Proc. SPIE 9574, Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems II, 95740C (September 2, 2015); doi:10.1117/12.2191445; http://dx.doi.org/10.1117/12.2191445


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