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Proceedings Article

Cost-effective manufacturing of compact TDLAS sensors for hazardous area applications

[+] Author Affiliations
Michael B. Frish, Mathew C. Laderer, Clinton J. Smith

Physical Sciences Inc. (United States)

Ryan Ehid, Joseph Dallas

Avo Photonics, Inc. (United States)

Proc. SPIE 9730, Components and Packaging for Laser Systems II, 97300P (April 22, 2016); doi:10.1117/12.2209402
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From Conference Volume 9730

  • Components and Packaging for Laser Systems II
  • Alexei L. Glebov; Paul O. Leisher
  • San Francisco, California, United States | February 13, 2016

abstract

Tunable Diode Laser Absorption Spectroscopy (TDLAS) is finding ever increasing utility for industrial process measurement and control. The technique’s sensitivity and selectivity benefit continuous concentration measurements of specific gas components in complex gas mixtures which are often laden with liquids or solid particulates. Tradeoff options among optical path length, absorption linestrength, linewidth, cross-interferences, and sampling methodology enable sensor designers to optimize detection for specific applications. Emerging applications are demanding increasing numbers of distributed miniaturized sensors at diminishing costs. In these applications, the TDLAS specificity is a key attribute, and its high sensitivity enables novel sampling package designs with short optical path lengths. This paper describes a miniature hermetically-sealed backscatter TDLAS transceiver package designed for high-volume production at acceptable cost. Occupying a volume less than 1in3 and weighing less than 0.06 lb, the transceiver is a key component of TDLAS sensors intended for in-situ measurements of potentially explosive gas mixtures. © (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

Michael B. Frish ; Mathew C. Laderer ; Clinton J. Smith ; Ryan Ehid and Joseph Dallas
" Cost-effective manufacturing of compact TDLAS sensors for hazardous area applications ", Proc. SPIE 9730, Components and Packaging for Laser Systems II, 97300P (April 22, 2016); doi:10.1117/12.2209402; http://dx.doi.org/10.1117/12.2209402


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