Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

Design technology co-optimization for 14/10nm metal1 double patterning layer

[+] Author Affiliations
Yingli Duan, Xiaojing Su, Ying Chen, Yajuan Su, Yayi Wei

Institute of Microelectronics (China)

Feng Shao, Recco Zhang, Junjiang Lei

Mentor Graphics Shanghai Electronic Technology Co. (China)

Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 97810X (March 16, 2016); doi:10.1117/12.2218711
Text Size: A A A
From Conference Volume 9781

  • Design-Process-Technology Co-optimization for Manufacturability X
  • Luigi Capodieci; Jason P. Cain
  • San Jose, California, United States | February 21, 2016

abstract

Design and technology co-optimization (DTCO) can satisfy the needs of the design, generate robust design rule, and avoid unfriendly patterns at the early stage of design to ensure a high level of manufacturability of the product by the technical capability of the present process. The DTCO methodology in this paper includes design rule translation, layout analysis, model validation, hotspots classification and design rule optimization mainly. The correlation of the DTCO and double patterning (DPT) can optimize the related design rule and generate friendlier layout which meets the requirement of the 14/10nm technology node. The experiment demonstrates the methodology of DPT-compliant DTCO which is applied to a metal1 layer from the 14/10nm node. The DTCO workflow proposed in our job is an efficient solution for optimizing the design rules for 14/10 nm tech node Metal1 layer. And the paper also discussed and did the verification about how to tune the design rule of the U-shape and L-shape structures in a DPT-aware metal layer. © (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

Yingli Duan ; Xiaojing Su ; Ying Chen ; Yajuan Su ; Feng Shao, et al.
" Design technology co-optimization for 14/10nm metal1 double patterning layer ", Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 97810X (March 16, 2016); doi:10.1117/12.2218711; http://dx.doi.org/10.1117/12.2218711


Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).

Figures

Tables

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.