Approach to hp10nm resolution by applying Dry Development Rinse Process (DDRP) and Materials (DDRM)

Wataru Shibayama; Shuhei Shigaki; Satoshi Takeda; Ryuji Onishi; Makoto Nakajima; Rikimaru Sakamoto

doi:10.1117/12.2219475

18 March 2016 Approach to hp10nm resolution by applying Dry Development Rinse Process (DDRP) and Materials (DDRM)

Wataru Shibayama, Shuhei Shigaki, Satoshi Takeda, Ryuji Onishi, Makoto Nakajima, Rikimaru Sakamoto

Proceedings Volume 9776, Extreme Ultraviolet (EUV) Lithography VII; 977609 (2016) https://doi.org/10.1117/12.2219475
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

EUV lithography has been desired as the leading technology for single nm half-pitch patterning. However, the source power, masks and resist materials still have critical issues for mass production. Especially in resist materials, RLS trade-off is the key issue. To overcome this issue, we are suggesting Dry Development Rinse Process (DDRP) and Materials (DDRM) as the pattern collapse mitigation approach. This DDRM can perform not only as pattern collapse free materials for fine pitch, but also as the etching hard mask against bottom layer (spin on carbon : SOC). In this paper, we especially propose new approaches to achieve high resolution around hp10nm. The key points of our concepts are 1) control PR profiles, 2) new solvent system to avoid chemical mixture, 3) high etching selective DDR materilas and 4) high planar DDR materials. This new DDRM technology can be the promising approach for hp10nm level patterning in N7/N5 and beyond.

Citation Download Citation

Wataru Shibayama, Shuhei Shigaki, Satoshi Takeda, Ryuji Onishi, Makoto Nakajima, and Rikimaru Sakamoto "Approach to hp10nm resolution by applying Dry Development Rinse Process (DDRP) and Materials (DDRM)", Proc. SPIE 9776, Extreme Ultraviolet (EUV) Lithography VII, 977609 (18 March 2016); https://doi.org/10.1117/12.2219475

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