Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

Numerical placement analysis in hole multiplication patterns for directed self-assembly

[+] Author Affiliations
K. Yamamoto, T. Nakano, K. Matsuzaki

Tokyo Electron Ltd. (Japan)

M. Muramatsu, H. Genjima, T. Tomita, T. Kitano

Tokyo Electron Kyushu Ltd. (Japan)

Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97771Q (April 1, 2016); doi:10.1117/12.2218596
Text Size: A A A
From Conference Volume 9777

  • Alternative Lithographic Technologies VIII
  • Christopher Bencher; Joy Y. Cheng
  • San Jose, California, United States | February 21, 2016

abstract

Placement of cylinders in hole multiplication patterns for directed self-assembly is the topic of this computational study. A hole doublet process applying a corner rounded rectangle guide is the focus of this work. Placements including morphology fluctuation can be analyzed by dissipative particle dynamics simulation. When the surface of guides and underlayers are modified from strong polymethyl methacrylate (PMMA) attractive to weak PMMA attractive, two PMMA cylinders can be contacted at the underlayer. Even when the PMMA domain had a separated morphology, hole placement errors (HPE) were similar to those with connected domains which occurred in the strong PMMA affine case. In general, HPE in longitudinal guide direction was larger than in the shorter direction. It is interesting to note that HPE in the longer direction was decreased by increasing the guide size in shorter direction. Cylinder tops likely fluctuate; cylinder middles may fluctuate as well in some cases. Means for HPE reduction were also tested computationally: reducing the guide thickness and employing dimpled structures. Decreasing guide thickness was effective for reducing HPE; however, guide thicknesses that were too thin prevented PMMA domains from forming vertical cylinders. Dimpled structures also reduced HPE. The depth of the dimple had a little influence on the distance of two holes when the guide structure was fitted with hexagonal packing for the block co-polymers. © (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

K. Yamamoto ; T. Nakano ; M. Muramatsu ; H. Genjima ; T. Tomita, et al.
" Numerical placement analysis in hole multiplication patterns for directed self-assembly ", Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97771Q (April 1, 2016); doi:10.1117/12.2218596; http://dx.doi.org/10.1117/12.2218596


Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).

Figures

Tables

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.