Paper
22 December 2016 Manufacturing of HfOxNy films using reactive magnetron sputtering for ISFET application
Piotr Firek, Piotr Wysokiński
Author Affiliations +
Proceedings Volume 10175, Electron Technology Conference 2016; 1017507 (2016) https://doi.org/10.1117/12.2261660
Event: Electron Technology Conference ELTE 2016, 2016, Wisla, Poland
Abstract
Hafnium Oxide-Nitride films were deposited using reactive magnetron sputtering in O2/N2/Ar gas mixture. Deposition was planned according to Taguchi optimization method. Morphology of fabricated layers was tested using AFM technique (Ra=0.2÷1,0 nm). Thickness of HfOXNY films was measured using spectroscopic ellipsometry (t=45÷54 nm). Afterwards MIS structures were created by Al metallization process then layers were electrically characterised using I-V and C-V measurements. This allowed to calculate the electrical parameters of layers such as: flat-band voltage UFB, dielectric constant Ki, interface state trap density Dit and effective charge Qeff. Subsequently, deposited HfOxNy layers were annealed in PDA process (40 min 400 °C 100% N2) after which the electrical characterization was performed again.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Piotr Firek and Piotr Wysokiński "Manufacturing of HfOxNy films using reactive magnetron sputtering for ISFET application", Proc. SPIE 10175, Electron Technology Conference 2016, 1017507 (22 December 2016); https://doi.org/10.1117/12.2261660
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Hybrid fiber optics

Dielectrics

Argon

Sputter deposition

Personal digital assistants

Field effect transistors

Manufacturing

Back to Top