Validation of thermal effects of LED package by using Elmer finite element simulation method

Lai Siang Leng; Vithyacharan Retnasamy; Mukhzeer Mohamad Shahimin; Zaliman Sauli; Steven Taniselass; Muhamad Hafiz Bin Ab Aziz; Rajendaran Vairavan; Supap Kirtsaeng

doi:10.1117/12.2257216

16 February 2017 Validation of thermal effects of LED package by using Elmer finite element simulation method

Lai Siang Leng, Vithyacharan Retnasamy, Mukhzeer Mohamad Shahimin, Zaliman Sauli, Steven Taniselass, Muhamad Hafiz Bin Ab Aziz, Rajendaran Vairavan, Supap Kirtsaeng

Author Affiliations +

Proceedings Volume 10124, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXI; 101241M (2017) https://doi.org/10.1117/12.2257216
Event: SPIE OPTO, 2017, San Francisco, California, United States

Abstract

The overall performance of the Light-emitting diode, LED package is critically affected by the heat attribution. In this study, open source software - Elmer FEM has been utilized to study the thermal analysis of the LED package. In order to perform a complete simulation study, both Salome software and ParaView software were introduced as Pre and Postprocessor. The thermal effect of the LED package was evaluated by this software. The result has been validated with commercially licensed software based on previous work. The percentage difference from both simulation results is less than 5% which is tolerable and comparable.

Citation Download Citation

Lai Siang Leng, Vithyacharan Retnasamy, Mukhzeer Mohamad Shahimin, Zaliman Sauli, Steven Taniselass, Muhamad Hafiz Bin Ab Aziz, Rajendaran Vairavan, and Supap Kirtsaeng "Validation of thermal effects of LED package by using Elmer finite element simulation method", Proc. SPIE 10124, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXI, 101241M (16 February 2017); https://doi.org/10.1117/12.2257216

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