EUV process improvement with novel litho track hardware

Harold Stokes; Masahiko Harumoto; Yuji Tanaka; Koji Kaneyama; Charles Pieczulewski; Masaya Asai

doi:10.1117/12.2259994

27 March 2017 EUV process improvement with novel litho track hardware

Harold Stokes, Masahiko Harumoto, Yuji Tanaka, Koji Kaneyama, Charles Pieczulewski, Masaya Asai

Proceedings Volume 10143, Extreme Ultraviolet (EUV) Lithography VIII; 101431Z (2017) https://doi.org/10.1117/12.2259994
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

Currently, there are many developments in the field of EUV lithography that are helping to move it towards increased HVM feasibility. Targeted improvements in hardware design for advanced lithography are of interest to our group specifically for metrics such as CD uniformity, LWR, and defect density. Of course, our work is focused on EUV process steps that are specifically affected by litho track performance, and consequently, can be improved by litho track design improvement and optimization. In this study we are building on our experience to provide continual improvement for LWR, CDU, and Defects as applied to a standard EUV process by employing novel hardware solutions on our SOKUDO DUO coat develop track system. Although it is preferable to achieve such improvements post-etch process we feel, as many do, that improvements after patterning are a precursor to improvements after etching. We hereby present our work utilizing the SOKUDO DUO coat develop track system with an ASML NXE:3300 in the IMEC (Leuven, Belgium) cleanroom environment to improve aggressive dense L/S patterns.

Citation Download Citation

Harold Stokes, Masahiko Harumoto, Yuji Tanaka, Koji Kaneyama, Charles Pieczulewski, and Masaya Asai "EUV process improvement with novel litho track hardware", Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101431Z (27 March 2017); https://doi.org/10.1117/12.2259994

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