New processes associated with electron-beam lithography for ultra-small resonators

Landobasa Y. M. Tobing; Dao Hua Zhang

doi:10.1117/12.2272621

27 March 2017 New processes associated with electron-beam lithography for ultra-small resonators

Landobasa Y. M. Tobing, Dao Hua Zhang

Proceedings Volume 10146, Advances in Patterning Materials and Processes XXXIV; 101461Q (2017) https://doi.org/10.1117/12.2272621
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

High density ultrahigh resolution patterning with desired shape and size is a crucial requirement in nanotechnology and its applications. Electron beam lithography (EBL) is the most widely used lithography tool for these applications. However, achieving cost-effective patterning with sub-10-nm critical dimension has been challenging due to the inherent tradeoff between resolution and throughput. In this paper, we present cost-effective new processes associated with EBL technique, which include optimized resist selection and processing as well as sonicated cold development process. Using this process, we demonstrate sub-10-nm diameter metal dots at a pitch of ~34 nm and sub-15 nm wide metal lines. Based on the same processes, we demonstrate the fabrication of u-shaped split ring resonator array of different metals with smallest fabricated resonator with ~60 nm size and v-shape SRRs with the smallest gap spacing of ~30 nm. By adjusting the SRR gap spacing through its arm length and opening angle, we have successfully demonstrated magnetic and electric resonances across the visible and ultraviolet range.

Citation Download Citation

Landobasa Y. M. Tobing and Dao Hua Zhang "New processes associated with electron-beam lithography for ultra-small resonators", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101461Q (27 March 2017); https://doi.org/10.1117/12.2272621

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