3D micro-lenses for free space intra-chip coupling in photonic-integrated circuits (Conference Presentation)

Robert Thomas; Gwilym I. Williams; Sam Ladak; Peter M. Smowton

doi:10.1117/12.2252213

20 April 2017 3D micro-lenses for free space intra-chip coupling in photonic-integrated circuits (Conference Presentation)

Robert Thomas, Gwilym I. Williams, Sam Ladak, Peter M. Smowton

Author Affiliations +

Proceedings Volume 10123, Novel In-Plane Semiconductor Lasers XVI; 101230W (2017) https://doi.org/10.1117/12.2252213
Event: SPIE OPTO, 2017, San Francisco, California, United States

Abstract

The integration of multiple optical elements on a common substrate to create photonic integrated circuits (PIC) has been successfully applied in: fibre-optic communications, photonic computing and optical sensing. The push towards III-Vs on silicon promises a new generation of integrated devices that combine the advantages of both integrated electronics and optics in a single substrate. III-V edge emitting laser diodes offer high efficiency and low threshold currents making them ideal candidates for the optically active elements of the next generation of PICs. Nevertheless, the highly divergent and asymmetric beam shapes intrinsic to these devices limits the efficiency with which optical elements can be free space coupled intra-chip; a capability particularly desirable for optical sensing applications e.g. [1]. Furthermore, the monolithic nature of the integrated approach prohibits the use of macroscopic lenses to improve coupling. However, with the advent of 3D direct laser writing, three dimensional lenses can now be manufactured on a microscopic-scale [2], making the use of micro-lens technology for enhanced free space coupling of integrated optical elements feasible. Here we demonstrate the first use of 3D micro-lenses to improve the coupling efficiency of monolithically integrated lasers. Fabricated from IP-dip photoresist using a Nanoscribe GmbH 3D lithography tool, the lenses are embedded directly onto a structured GaInP/AlGaInP substrate containing arrays of ridge lasers free space coupled to one another via a 200 μm air gap. We compare the coupling efficiency of these lasers with and without micro-lenses through photo-voltage and beam profile measurements and discuss optimisation of lens design.

Conference Presentation

Citation Download Citation

Robert Thomas, Gwilym I. Williams, Sam Ladak, and Peter M. Smowton "3D micro-lenses for free space intra-chip coupling in photonic-integrated circuits (Conference Presentation)", Proc. SPIE 10123, Novel In-Plane Semiconductor Lasers XVI, 101230W (20 April 2017); https://doi.org/10.1117/12.2252213

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
PRESENTATION

WATCH
PRESENTATION SAVE TO MY LIBRARY

GET CITATION

KEYWORDS

Free space

Photonic integrated circuits

Optical components

Lenses

3D metrology

Integrated optics

Optical sensing

Show All Keywords

Keywords/Phrases

Search In:

Publication Years