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The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org. The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon. Please use the following format to cite material from these proceedings: Author(s), “Title of Paper,” in Laser 3D Manufacturing IV, edited by Bo Gu, Henry Helvajian, Alberto Piqué, Corey M. Dunsky, Jian Liu, Proceedings of SPIE Vol. 10095 (SPIE, Bellingham, WA, 2017) Seven-digit Article CID Number. ISSN: 0277-786X ISSN: 1996-756X (electronic) ISBN: 9781510606319 ISBN: 9781510606326 (electronic) Published by SPIE P.O. Box 10, Bellingham, Washington 98227-0010 USA Telephone +1 360 676 3290 (Pacific Time) · Fax +1 360 647 1445 Copyright © 2017, Society of Photo-Optical Instrumentation Engineers. Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of copying fees. The Transactional Reporting Service base fee for this volume is $18.00 per article (or portion thereof), which should be paid directly to the Copyright Clearance Center (CCC), 222 Rosewood Drive, Danvers, MA 01923. Payment may also be made electronically through CCC Online at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher. The CCC fee code is 0277-786X/17/$18.00. Printed in the United States of America. Publication of record for individual papers is online in the SPIE Digital Library.
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AuthorsNumbers in the index correspond to the last two digits of the six-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first four digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc. Abe, Nobuyuki, 0X, 0Z Altana, Mirco, 07 Arntz, Kristian, 0U Asano, K., 0X Barajas-González, O. G., 11 Barclay, Paul E., 0Q Bharadwaj, Vibhav, 0Q Bosia, Federico, 0Q Chiappini, Andrea, 0Q Chidambaram, Nachiappan, 07 Coker, Zachary, 0I Dahlgren, Robert P., 0J Dary, Omar G, 0J Eaton, Shane M., 0Q Fernandez, Toney T., 0Q Ferrari, Maurizio, 0Q Franco-Herrada, M. G., 11 Funada, Y., 0X García-Garza, A. K., 11 García-Ramírez, M. A., 11 Goel, Sanket, 0C Grishkanich, Alexsandr S., 14 Guzmán-González, J. V., 11 Guzmán-Ramos, V., 11 Hadden, J.P., 0Q Hattel, Jesper Henri, 0G Higashino, Ritsuko, 0X, 0Z Iakovlev, Alexey, 14 Kim, Young Ho, 0C Kirchner, Robert, 07 Klingbeil, Nils, 0U Klocke, Fritz, 0U Li, Jin, 12 Lucas, Mark, 12 Luo, Xi, 12 Mazhari, Arash Alex, 0J Meng, Zhaokai, 0I Miura, Kiyotaka, 0Q Mohanty, Sankhya, 0G Nodurft, Dawson, 0I Ogunbiyi, Joab A., 0J Olivero, Paolo, 0Q Osellame, Roberto, 0Q Picollo, Federico, 0Q Pinsker, Ethan A., 0J Rampini, Stefano, 0Q Ramponi, Roberta, 0Q Redka, Dmitriy, 14 S.B., Puneeth, 0C Sakakura, Masaaki, 0Q Saldaña-Martínez, M. I., 11 Sato, Yuji, 0X, 0Z Schift, Helmut, 07 Schulz, Martin, 0U Selvas Aguilar, R. J., 11 Sotillo, Belén, 0Q Tsukamoto, Masahiro, 0X, 0Z Tsvetkov, Konstantin, 14 Wang, Xuan, 06 West, Connor, 06 Yakovlev, Vladislav V., 0I Yamagata, Shuto, 0Z Yamashita, Kensuke, 0Z Yamashita, Yorihiro, 0Z Conference CommitteeSymposium Chairs Symposium Co-chairs
Program Track Chairs
Conference Chairs
Conference Program Committee
Conference Review Committee Session Chairs
IntroductionLaser Additive Manufacturing(LAM), or 3D Laser Printing, has opened up new opportunities while facing up to many challenges. Market analysts valued the global 3D printing market at $2.3B in 2013 and are projecting global revenues of $8.6B by 2020—an impressive compound annual growth rate of more than 20% over seven years! At the same time, it is estimated that 3D printing will become 50% less expensive and 400% faster over the next five years. However, 3D printing technology can only reach its economic potential and fulfill its promise of revolutionizing manufacturing across multiple industries if a number of significant real-world structural challenges are addressed. The Laser 3D Printing Manufacturing Conference at Photonics West provides such a forum to discuss and address some of these challenges. It has become the conference where professionals from multiple disciplines share and discuss the latest advances in the field of laser-based digital manufacturing and the development and implementation of next generation laser-based 3D manufacturing processes. We believe that this type of cross talk and communication amongst conference speakers and attendees from all fields related to LAM, which include material science, laser processing physics/chemistry, mechanical engineering, software and designing tools, modeling, characterization and metrology, is not only necessary for maturing the field but very much needed to spark new ideas. Potentially a disruptive game changer, 3D Laser Printing is still a relatively new technology and definitely needs further development. While it has already been disrupting the manufacturing value chain and allowing a path to mass producing customized products, and in some applications it has already reached a tipping point of maturity. However, many issues remain that need to be tackled. We will continue to encourage researchers and engineers to submit their work to this conference to help fully reach LAM potential. Finally, we would like to thank all of the speakers and attendees for their great contribution to the conference. We hope that more people will come and share their work and exchange ideas at this unique platform next year. After all, this is what this conference is all about--it is for you. Bo Gu Henry Helvajian Alberto Piqué Corey M. Dunsky Jian Lu |
