Thermal analysis of fused deposition modeling process using infrared thermography imaging and finite element modeling

Xunfei Zhou; Sheng-Jen Hsieh

doi:10.1117/12.2262796

5 May 2017 Thermal analysis of fused deposition modeling process using infrared thermography imaging and finite element modeling

Xunfei Zhou, Sheng-Jen Hsieh

Author Affiliations +

Proceedings Volume 10214, Thermosense: Thermal Infrared Applications XXXIX; 1021409 (2017) https://doi.org/10.1117/12.2262796
Event: SPIE Commercial + Scientific Sensing and Imaging, 2017, Anaheim, CA, United States

Abstract

After years of development, Fused Deposition Modeling (FDM) has become the most popular technique in commercial 3D printing due to its cost effectiveness and easy-to-operate fabrication process. Mechanical strength and dimensional accuracy are two of the most important factors for reliability of FDM products. However, the solid-liquid-solid state changes of material in the FDM process make it difficult to monitor and model. In this paper, an experimental model was developed to apply cost-effective infrared thermography imaging method to acquire temperature history of filaments at the interface and their corresponding cooling mechanism. A three-dimensional finite element model was constructed to simulate the same process using element "birth and death" feature and validated with the thermal response from the experimental model. In 6 of 9 experimental conditions, a maximum of 13% difference existed between the experimental and numerical models. This work suggests that numerical modeling of FDM process is reliable and can facilitate better understanding of bead spreading and road-to-road bonding mechanics during fabrication.

Citation Download Citation

Xunfei Zhou and Sheng-Jen Hsieh "Thermal analysis of fused deposition modeling process using infrared thermography imaging and finite element modeling", Proc. SPIE 10214, Thermosense: Thermal Infrared Applications XXXIX, 1021409 (5 May 2017); https://doi.org/10.1117/12.2262796

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