Reticle processing: overview of current and future reticle processing systems and system improvements that will enable the reticle manufacturer to meet future needs

Kathy S. Milner

doi:10.1117/12.177442

1 January 1994 Reticle processing: overview of current and future reticle processing systems and system improvements that will enable the reticle manufacturer to meet future needs

Kathy S. Milner

Author Affiliations +

Proceedings Volume 10273, 64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review; 102730A (1994) https://doi.org/10.1117/12.177442
Event: 13th Annual BACUS Symposium on Photomask Technology and Management, 1993, Santa Clara, CA, United States

Abstract

As the semiconductor industry progresses to 64Mb technology, and beyond to 256Mb, reticle technology will be a major factor in wafer yield. The industry focus is currently on "optical extensions", to the extent that optical lithography may remain the primary technology down to 0.20 pm resolution, and perhaps beyond. For the reticle manufacturer, this translates into dramatically reduced tolerances for critical dimension control, line edge roughness, registration, and defect size. To meet the more stringent criteria, critical process capabilities must advance at a significantly greater rate than that accomplished during the past several years. With the advent of phase shift masks, the demands for technology development will be that much greater.

Among the areas of reticle manufacturing which must improve substantially to meet future requirements are: resist optimization, process automation and control, dry etching, feature linearity, submicron feature processing, reticle blanks and process chemistry. Additionally, the reticle manufacturer must identify, analyze, and reduce the component errors of process, equipment and raw materials.

This paper will review the evolution of reticle processing through the current state-of-the- art, and will assess the equipment, methodology, and materials required to extend reticle manufacture capabilities to the level required by 256Mb technology.

Citation Download Citation

Kathy S. Milner "Reticle processing: overview of current and future reticle processing systems and system improvements that will enable the reticle manufacturer to meet future needs", Proc. SPIE 10273, 64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review, 102730A (1 January 1994); https://doi.org/10.1117/12.177442

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
21 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Reticles

Manufacturing

Control systems

Photoresist processing

Process control

Optical lithography

Optics manufacturing

Show All Keywords

Keywords/Phrases

Search In:

Publication Years