Conference Committee
Conference Chairs
Ray T. Chen, University of Texas/Austin
Peter S. Guilfoyle, OptiComp Corporation
Session Chairs
1 Free-Space Optoelectronic Interconnects
Peter S. Guilfoyle, OptiComp Corporation
2 Interconnect Architectures
Julian P. Bristow, Honeywell Inc.
3 High-Speed Transceivers for Optoelectronic Interconnects
Yao Li, NEC Research Institute
4 Backplane Optoelectronic Interconnects
Randy W. Wickman, Cray Research Inc.
5 Intra- and Inter-MCM Optoelectronic Interconnects
Yung S. Liu, GE Corporate Research and Development Center
6 Optoelectronic Packaging
Ray T. Chen, University of Texas/Austin
Preface
Optoelectronic interconnects and packaging are becoming increasingly important due to the requirement of high-speed, large-capacity transmission of information. Such a demand in many scenarios such as machine-to-machine and module-to-module interconnects can only be realized by employing optoelectronic technology.
In this critical review, we have invited 26 internationally known experts in this field to address such critical technical issues as vertical cavity surface emitting lasers, photodetectors, holograms and smart pixel arrays for both guided wave and free-space optoelectronic interconnects. Architecture-related subjects are also delineated to provide a global picture of future development. Several system demonstrations, including 500-MHz optical clock signal distribution for Cray Research’s T-90 machine, ARPA-sponsoredPOINT and POLO programs, and the most recent developments on optoelectronic packaging are also detailed in this book.
We expect the engineers, scientists, and students in this field to find this book useful for their research.
Ray T. Chen
Peter S. Guilfoyle
