Several interconnect Junctions within cabinets comprising high performance computers are pushing the limits of electrical interconnect technology. A widespread problem of limited interconnect density at the board-to-backplane interface has been identified, while advances in clock speed and cabinet functionality are expected to stress electrical interconnects first for high fanout applications, then for high speed point-to-point parallel interconnects. Key components are described, and from these components the design of a generic optical backplane technology is described. While components are now available to implement a practical solution, the use of proven electrical techniques is considered an important step in hastening the introduction of the technology.
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Citation
Julian Bristow
"
Intracomputer optical interconnects: progress and challenges
", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging, 102840H (July 7, 2017); doi:10.1117/12.229268; http://dx.doi.org/10.1117/12.229268
