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Proceedings Article

Optical interconnection using polyimide waveguide for multichip module

[+] Author Affiliations
Mitsumasa Koyanagi

Tohoku Univ. (Japan)

Proc. SPIE 10284, Optoelectronic Interconnects and Packaging, 102840J (July 7, 2017); doi:10.1117/12.229269
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From Conference Volume 10284

  • Optoelectronic Interconnects and Packaging
  • Bellingham, United States | January 13, 2017

abstract

We have developed a parallel processor system with 152 RISC processor chips specific for Monte-Carlo analysis. This system has the ring-bus architecture. The performance of several Gflops is expected in this system according to the computer simulation. However, it was revealed that the data transfer speed of the bus has to be increased more dramatically in order to further increase the performance. Then, we propose to introduce the optical interconnection into the parallel processor system to increase the data transfer speed of the buses. The double ringbus architecture is employed in this new parallel processor system with optical interconnection. The free-space optical interconnection arid the optical waveguide are used for the optical ring-bus. Thin polyimide film was used to form the optical waveguide. A relatively low propagation loss was achieved in the polyimide optical waveguide. In addition, it was confirmed that the propagation direction of signal light can be easily changed by using a micro-mirror. © (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

Mitsumasa Koyanagi
" Optical interconnection using polyimide waveguide for multichip module ", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging, 102840J (July 7, 2017); doi:10.1117/12.229269; http://dx.doi.org/10.1117/12.229269


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