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Proceedings Article

Potential of LIGA technology for optoelectronic interconnects

[+] Author Affiliations
W. Bacher, Peter Bley, Herbert O. Moser

Forschungszentrum Karlsruhe GmbH (Germany)

Proc. SPIE 10284, Optoelectronic Interconnects and Packaging, 102840R (July 7, 2017); doi:10.1117/12.229277
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From Conference Volume 10284

  • Optoelectronic Interconnects and Packaging
  • Bellingham, United States | January 13, 2017

abstract

LIGA is a fabrication technology suitable for mass producing high aspect-ratio microstructured components with nearly arbitrary 3D shapes in almost any material. The acronym stems from the German words for lithography, electroforming, and plastic molding. Fabricating highly parallel microoptical systems either for guided-wave or for free-space light transmission by LIGA technology may turn out to be a cost-effective way to satisfy optical interconnect demands. © (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

W. Bacher ; Peter Bley and Herbert O. Moser
" Potential of LIGA technology for optoelectronic interconnects ", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging, 102840R (July 7, 2017); doi:10.1117/12.229277; http://dx.doi.org/10.1117/12.229277


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