Micro-optics packaging and integration for high-power diode laser beam combining

Y. G. Soskind

doi:10.1117/12.874178

17 January 2011 Micro-optics packaging and integration for high-power diode laser beam combining

Y. G. Soskind

Proceedings Volume 7944, Optoelectronic Interconnects and Component Integration XI; 79440T (2011) https://doi.org/10.1117/12.874178
Event: SPIE OPTO, 2011, San Francisco, California, United States

Abstract

High power diode laser beam combining using micro-optics components is emerging as a cost-effective technique for producing high power laser output from small-sized laser packages. Packaging of micro-optics lenses and lens arrays that are matched to lithographically fabricated diode laser waveguides provides a practical approach for combining multiple field distributions into a single high output power beam. Beam combining is often associated with additional output beam shaping that is tailored to a specific photonics application which the laser is intended for, such as surface treatment or micro-fabrication, photomedicine, laser pumping, or remote spectroscopy. It is shown that packaging imperfections and components' misalignments during the packaging phase influence the output laser beam spatial characteristics and produce specific beam distortions. Micro-optics design optimized for packaging and integration reduces the beam distortions caused by packaging imperfections, such as post-bonding shifts and lens-induced aberrations. Another role of optical design optimization and tolerance analysis is in providing a deterministic approach for distinguishing specific misalignment effects based on the observed distortions of the beam distributions. This, in turn, is used to develop appropriate compensation techniques that can be applied to improve the quality of the combined beam output during the fabrication process.

Citation Download Citation

Y. G. Soskind "Micro-optics packaging and integration for high-power diode laser beam combining", Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440T (17 January 2011); https://doi.org/10.1117/12.874178

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