Phase shifting holographic interferometer for precise alignment measurements in packaging applications

Vladimir V. Nikulin; Rahul Khandekar; Vijit Bedi

doi:10.1117/12.874282

7 February 2011 Phase shifting holographic interferometer for precise alignment measurements in packaging applications

Vladimir V. Nikulin, Rahul Khandekar, Vijit Bedi

Proceedings Volume 7957, Practical Holography XXV: Materials and Applications; 79570N (2011) https://doi.org/10.1117/12.874282
Event: SPIE OPTO, 2011, San Francisco, California, United States

Abstract

One of the main challenges in optoelectronic and photonic applications is the alignment accuracy after bonding of the components is completed, especially if there are multiple single-mode alignments. Advanced applications often require positioning accuracy of these components to be within a sub-micron range in order to avoid unacceptable signal degradation. Also, there is a concern about the effects of certain processing techniques on component integrity. In all cases, the extent to which a package is affected can only be evaluated by a measurement approach that allows detecting misalignments/deformations on the order of 10nm. Unfortunately, many conventional techniques are virtually useless when measurements are performed on diffuse objects, such as photonic packages. These limitations can be avoided using holography, which facilitates recording and reconstruction of the optical waves reflected from any surface. In the process of reconstruction it is possible to reproduce not only the amplitude of the reflected wave, but also its phase distribution, which carries information about the distance to each point illuminated with light. An optical technique developed by our group and presented in this paper is based on a holographic approach and combines the principles of holographic interferometry and phase modulating adaptive optics.

Citation Download Citation

Vladimir V. Nikulin, Rahul Khandekar, and Vijit Bedi "Phase shifting holographic interferometer for precise alignment measurements in packaging applications", Proc. SPIE 7957, Practical Holography XXV: Materials and Applications, 79570N (7 February 2011); https://doi.org/10.1117/12.874282

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