A new methodology for TSV array inspection

Yoshihiko Fujimori; Takashi Tsuto; Yuji Kudo; Takeshi Inoue; Kazuya Okamoto

doi:10.1117/12.879379

20 April 2011 A new methodology for TSV array inspection

Yoshihiko Fujimori, Takashi Tsuto, Yuji Kudo, Takeshi Inoue, Kazuya Okamoto

Proceedings Volume 7971, Metrology, Inspection, and Process Control for Microlithography XXV; 79710I (2011) https://doi.org/10.1117/12.879379
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

A new methodology for inspection of TSV (Through Silicon Via) process wafers is developed by utilizing an optical diffraction signal from the wafers. The optical system uses telecentric illumination and has a two-dimensional sensor in order to capture the diffraction light from TSV arrays. The diffraction signal modulates the intensity of the wafer image. Furthermore, the optical configuration itself is optimized. The diffraction signal is sensitive to via-shape variations, and an abnormal via area is analyzed using the signal. Using the test wafers with deep hole patterns on silicon wafers, the performance is evaluated and the sensitivities for various pattern profile changes were confirmed. This new methodology is available for high-volume manufacturing of the future TSV-3D CMOS devices.

Citation Download Citation

Yoshihiko Fujimori, Takashi Tsuto, Yuji Kudo, Takeshi Inoue, and Kazuya Okamoto "A new methodology for TSV array inspection", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79710I (20 April 2011); https://doi.org/10.1117/12.879379

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available