Modeling of double patterning interactions in litho-cure-litho-etch (LCLE) processes

Andreas Erdmann; Feng Shao; Juergen Fuhrmann; Andre Fiebach; George P. Patsis; Peter Trefonas

doi:10.1117/12.845849

3 March 2010 Modeling of double patterning interactions in litho-cure-litho-etch (LCLE) processes

Andreas Erdmann, Feng Shao, Juergen Fuhrmann, Andre Fiebach, George P. Patsis, Peter Trefonas

Proceedings Volume 7640, Optical Microlithography XXIII; 76400B (2010) https://doi.org/10.1117/12.845849
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

This paper uses advanced modeling techniques to explore interactions between the two lithography processes in a lithocure- etch process and to qualify their impact on the final resist profiles and process performance. Specifically, wafer topography effects due to different optical properties of involved photoresist materials, linewidth variations in the second lithography step due to partial deprotection of imperfectly cured resist, and acid/quencher diffusion effects between resist materials are investigated. The paper highlights the results of the simulation work package of the European MD3 project.

Citation Download Citation

Andreas Erdmann, Feng Shao, Juergen Fuhrmann, Andre Fiebach, George P. Patsis, and Peter Trefonas "Modeling of double patterning interactions in litho-cure-litho-etch (LCLE) processes", Proc. SPIE 7640, Optical Microlithography XXIII, 76400B (3 March 2010); https://doi.org/10.1117/12.845849

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