Paper
24 April 2003 Novel three-axis silicon probe with integrated circuit on chip for microsystem components
Vladimir Nesterov, Petcharin Pornnoppadol, Uwe Brand, Ralph Wilke, M. Schmidt, Stephanus Buettgenbach
Author Affiliations +
Proceedings Volume 5116, Smart Sensors, Actuators, and MEMS; (2003) https://doi.org/10.1117/12.499264
Event: Microtechnologies for the New Millennium 2003, 2003, Maspalomas, Gran Canaria, Canary Islands, Spain
Abstract
A three-axis micro probe with wiring of the piezoresistors to Wheatstone bridges on the silicon membrane was currently developed for application in high precision coordinate measuring machines (CMM). The methods and results of the experimental investigation of the main properties of the 3d micro probe are presented. The influence of temperature and light onto the probe performance is described. Finally a brief outlook on the optimization of the threshold sensitivity is given.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vladimir Nesterov, Petcharin Pornnoppadol, Uwe Brand, Ralph Wilke, M. Schmidt, and Stephanus Buettgenbach "Novel three-axis silicon probe with integrated circuit on chip for microsystem components", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); https://doi.org/10.1117/12.499264
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CITATIONS
Cited by 9 scholarly publications.
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KEYWORDS
Doping

Temperature metrology

Silicon

Wheatstone bridges

3D metrology

Bridges

Resistance

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