Paper
28 August 2003 Improve accuracy of empirical models with multiple models
Youping Zhang, Minghui Fan
Author Affiliations +
Abstract
Lithography process modeling is critical for effective model-based optical proximity correction (OPC) or verification. Physics based full resist and etching model can provide very accurate prediction of the resist profile, but its speed forbids the use in practical production OPC and verification applications. Simplified models have therefore been developed. These models collapse some complicated but less crucial physics into "parameters" which are tuned to best fit the real measurement data. However, as the feature patterns vary, the aerial image around the patterns can experience a wide range of intensity distribution patterns. It is difficult to use a single set of "parameters" to fit into all these profiles. As compromises are made, accuracy suffers. The properties that contribute to such variations are primarily pattern shapes, dimensions, and in the case of phase-shift masks, phase-interaction. One way to improve the model accuracy is to build multiple "local" models such that each model contains a set of parameters that are optimized for the given pattern. As we perform simulation, we identify the pattern and then pick the model that is best suited for the given pattern. In this paper, we demonstrate how it is difficult for a single model to fit a set of data with large varying patterns. Then we show how multiple model methodology can be applied to improve model accuracy. As we apply the models, there will be "gray" areas where the pattern is not clearly identified to belong to the class for which a model is available. We explain how such situation should be coped with, and how the simulation responds to model "switching".
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Youping Zhang and Minghui Fan "Improve accuracy of empirical models with multiple models", Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); https://doi.org/10.1117/12.504254
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KEYWORDS
Data modeling

Binary data

Calibration

Process modeling

Phase shifts

Semiconducting wafers

Lithography

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