Packaging of MEMS microphones

Gregor Feiertag; Matthias Winter; Anton Leidl

doi:10.1117/12.821186

18 May 2009 Packaging of MEMS microphones

Gregor Feiertag, Matthias Winter, Anton Leidl

Proceedings Volume 7362, Smart Sensors, Actuators, and MEMS IV; 73620D (2009) https://doi.org/10.1117/12.821186
Event: SPIE Europe Microtechnologies for the New Millennium, 2009, Dresden, Germany

Abstract

To miniaturize MEMS microphones we have developed a microphone package using flip chip technology instead of chip and wire bonding. In this new packaging technology MEMS and ASIC are flip chip bonded on a ceramic substrate. The package is sealed by a laminated polymer foil and by a metal layer. The sound port is on the bottom side in the ceramic substrate. In this paper the packaging technology is explained in detail and results of electro-acoustic characterization and reliability testing are presented. We will also explain the way which has led us from the packaging of Surface Acoustic Wave (SAW) components to the packaging of MEMS microphones.

Citation Download Citation

Gregor Feiertag, Matthias Winter, and Anton Leidl "Packaging of MEMS microphones", Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620D (18 May 2009); https://doi.org/10.1117/12.821186

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