Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication

Ya Cheng; Zhizhan Xu; Koji Sugioka; Katsumi Midorikawa

doi:10.1117/12.838655

23 February 2010 Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication

Ya Cheng, Zhizhan Xu, Koji Sugioka, Katsumi Midorikawa

Author Affiliations +

Proceedings Volume 7585, Laser-based Micro- and Nanopackaging and Assembly IV; 75850D (2010) https://doi.org/10.1117/12.838655
Event: SPIE LASE, 2010, San Francisco, California, United States

Abstract

Recently, hybrid integration of multifunctional micro-components for creating complex, intelligent micro/nano systems has attracted significant attention. These micro/nano systems have important applications in a variety of areas, such as healthcare, environment, communication, national security, and so on. Until now, fabrication of micro/nano systems incorporated with different functions is still a challenging issue, which generally requires fabrication of microcomponents beforehand followed by assembly and packaging procedures. Thus, the fabrication process is complex and costly. In recent years, the rapid development of femtosecond laser microfabrication technology has enabled direct fabrication and integration of multifunctional components, such as microfluidics, microoptics, micromechanics, microelectronics, etc., into a substrate. Particularly, in this talk, we show the use of femtosecond laser microfabrication for integrating microelectronics and microphotonics. Both microelectrodes and optical waveguides can be directly embedded in active materials after a femtosecond laser direct writing followed by electroless chemical plating. As examples, electric-optic (EO) modulators were fabricated in lithium niobate (LiNbO₃) crystal and their functions were demonstrated.

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Ya Cheng, Zhizhan Xu, Koji Sugioka, and Katsumi Midorikawa "Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 75850D (23 February 2010); https://doi.org/10.1117/12.838655

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KEYWORDS

Femtosecond phenomena

Copper

Silver

Glasses

Waveguides

Electroless plating

Electrodes

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