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Proceedings Article

Deposition of polymer barrier materials by resonant infrared pulsed laser ablation

[+] Author Affiliations
S. M. Avanesyan, A. Halabica, S. L. Johnson, K. E. Schriver, R. F. Haglund, Jr.

Vanderbilt Univ. (USA)

M. J. Kelley

College of William and Mary (USA) and Thomas Jefferson National Accelerator Facility (USA)

J. M. Klopf

Thomas Jefferson National Accelerator Facility (USA)

H. K. Park

AppliFlex LLC (USA)

S. Singaravelu

Thomas Jefferson National Accelerator Facility (USA) and Old Dominion Univ. (USA)

Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758507 (February 23, 2010); doi:10.1117/12.846417
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From Conference Volume 7585

  • Laser-based Micro- and Nanopackaging and Assembly IV
  • Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Jun Amako; Willem Hoving
  • San Francisco, California, USA | January 23, 2010

abstract

We describe resonant infrared pulsed laser deposition (RIR-PLD) of cyclic olefin copolymer, a barrier and protective layer; for comparison, we describe RIR-PLD of polystyrene and poly(ethylene dioxythiophene) about which we already have significant knowledge. Film deposition based on resonant infrared laser ablation is a low-temperature process leading to evaporation and deposition of intact molecules. In this paper, we focus on deposition of this model barrier and protective material that is potentially useful in the fabrication of organic light emitting diodes. The films were characterized by scanning electron microscopy and Fourier-transform infrared spectroscopy. We also compared the properties of films deposited by a free electron laser and a picosecond optical parametric oscillator.

© (2010) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

S. M. Avanesyan ; A. Halabica ; S. L. Johnson ; M. J. Kelley ; J. M. Klopf, et al.
"Deposition of polymer barrier materials by resonant infrared pulsed laser ablation", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758507 (February 23, 2010); doi:10.1117/12.846417; http://dx.doi.org/10.1117/12.846417


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