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Proceedings Article

Mask industry assessment: 2009

[+] Author Affiliations
Greg Hughes

SEMATECH (USA)

Henry Yun

SEMATECH (USA) and Intel Corp. (USA)

Proc. SPIE 7488, Photomask Technology 2009, 748803 (September 29, 2009); doi:10.1117/12.832722
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From Conference Volume 7488

  • Photomask Technology 2009
  • Larry S. Zurbrick; M. Warren Montgomery
  • Monterey, CA | September 14, 2009

abstract

Microelectronics industry leaders routinely name the cost and cycle time of mask technology and mask supply as top critical issues. A survey was created with support from SEMATECH and administered by David Powell Consulting to gather information about the mask industry as an objective assessment of its overall condition. The survey is designed with the input of semiconductor company mask technologists and merchant mask suppliers. This year's assessment is the eighth in the current series of annual reports. With ongoing industry support, the report can be used as a baseline to gain perspective on the technical and business status of the mask and microelectronics industries. The report will continue to serve as a valuable reference to identify the strengths and opportunities of the mask industry. The results will be used to guide future investments pertaining to critical path issues. This year's survey is basically the same as the 2005 through 2008 surveys. Questions are grouped into categories: General Business Profile Information, Data Processing, Yields and Yield Loss Mechanisms, Delivery Times, Returns, and Services. Within each category is a multitude of questions that create a detailed profile of both the business and technical status of the critical mask industry. This in combination with the past surveys represents a comprehensive view of changes in the industry.

© (2009) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Greg Hughes and Henry Yun
"Mask industry assessment: 2009", Proc. SPIE 7488, Photomask Technology 2009, 748803 (September 29, 2009); doi:10.1117/12.832722; http://dx.doi.org/10.1117/12.832722


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