External efficiency and thermal reliability enhanced multi-chip package design for light emitting diodes

Meng-Han Tang; Tsung-Han Wu; Guo-Dung J. Su

doi:10.1117/12.800069

2 September 2008 External efficiency and thermal reliability enhanced multi-chip package design for light emitting diodes

Meng-Han Tang, Tsung-Han Wu, Guo-Dung J. Su

Author Affiliations +

Proceedings Volume 7058, Eighth International Conference on Solid State Lighting; 70580Q (2008) https://doi.org/10.1117/12.800069
Event: Optical Engineering + Applications, 2008, San Diego, California, United States

Abstract

With the power of light emitting diodes (LEDs) getting higher and higher, the issue of thermal management is getting much more important. In this paper, we discussed a new idea to get white light without using traditional phosphor and to enhance its extraction efficiency. Microlens is used for increasing external efficiency and shaping light pattern. The location of micro-lens is designed carefully by considering cup reflection. We also revealed that it is important to consider the angle of exit light from LEDs. The result shows our design is suitable for high color rendering index (CRI) application. At the same time, the uniform white light is approached as the light has been strongly diffused. Furthermore, we try to decrease the junction temperature as low as possible so as to increase stability and lifetime of LEDs. In order to maintain color mixing and dissipate heat, multi-chip or four pairs of electrodes which are electroplated with copper after bulk micromachining process within a silicon-based package are used. This novel packaging technique needs just a few processing steps and could be mass produced for nowadays high brightness light emitting diodes (HBLEDs).

Citation Download Citation

Meng-Han Tang, Tsung-Han Wu, and Guo-Dung J. Su "External efficiency and thermal reliability enhanced multi-chip package design for light emitting diodes", Proc. SPIE 7058, Eighth International Conference on Solid State Lighting, 70580Q (2 September 2008); https://doi.org/10.1117/12.800069

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available