Paper
12 February 2009 Advances in high-power laser diode packaging
Ed Wolak, Cameron Mitchell, Trevor Crum, Oscar Romero, John Gloyd, Daming Liu, Serge Cutillas, Sang-Ki Park, Kelly Johnson, Xu Jin, Hanxuan Li, Terry Towe, Irving Chyr, Robert Miller, Arne Meissner, Dino Lenarduzzi, James Harrison
Author Affiliations +
Abstract
High-power, packaged diode-laser sources continue to evolve through co-engineering of epitaxial design, beam conditioning and thermal management. Here we review examples of improvements made to key attributes including reliable power, brightness, power per unit volume and value.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ed Wolak, Cameron Mitchell, Trevor Crum, Oscar Romero, John Gloyd, Daming Liu, Serge Cutillas, Sang-Ki Park, Kelly Johnson, Xu Jin, Hanxuan Li, Terry Towe, Irving Chyr, Robert Miller, Arne Meissner, Dino Lenarduzzi, and James Harrison "Advances in high-power laser diode packaging", Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210U (12 February 2009); https://doi.org/10.1117/12.810549
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Fiber couplers

Diodes

High power lasers

Semiconductor lasers

Reliability

Heatsinks

Packaging

RELATED CONTENT

Highly-efficient high-power pumps for fiber lasers
Proceedings of SPIE (February 22 2017)
Fiber coupled high-power multi-mode diode pump lasers
Proceedings of SPIE (November 29 2012)
Low profile flat pack a high power fiber coupled...
Proceedings of SPIE (June 10 2004)
Advances in fiber combined pump modules for fiber lasers
Proceedings of SPIE (February 23 2009)
Overview on new diode lasers for defense applications
Proceedings of SPIE (November 08 2012)

Back to Top