Pre-OPC layout decomposition for improved image fidelity

Shady Abdelwahed; Rami Fathy; Jae Hyun Kang; Jong Doo Kim; Youngmi Kim

doi:10.1117/12.816825

16 March 2009 Pre-OPC layout decomposition for improved image fidelity

Shady Abdelwahed, Rami Fathy, Jae Hyun Kang, Jong Doo Kim, Youngmi Kim

Proceedings Volume 7274, Optical Microlithography XXII; 72742I (2009) https://doi.org/10.1117/12.816825
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

In microelectronics manufacturing, photolithography is the art of transferring pattern shapes printed on a mask to silicon wafers by the use of special imaging systems. These imaging systems stopped reducing exposure wavelength at 193nm. However, the industry demand for tighter design shapes and smaller structures on wafer has not stopped. To overcome some of the restrictions associated with the photographic process, new methods for Resolution Enhancement Techniques (RET) are being constantly explored and applied. An essential step in any RET method is Optical Proximity Correction (OPC). In this process the edges of the target desired shapes are manipulated to compensate for light diffraction effects and result in shapes on wafer as close as possible to the desired shapes. Manipulation of the shapes is always restricted by Mask Rules Checks (MRCs). The MRCs are the rules that assure that the pattern coming out of OPC can be printed on the mask without any catastrophic faults. Essential as they are, MRCs also place constrains on the solutions explored by the OPC algorithms. In this paper, an automated algorithm has been implemented to overcome MRC limitations to RET by decomposing the original layout at the places where regular RET hit the MRC during OPC.This algorithm has been applied to test cases where simulation results showed much better printability than the normal conventional solutions. This solution has also been tested and verified on silicon.

Citation Download Citation

Shady Abdelwahed, Rami Fathy, Jae Hyun Kang, Jong Doo Kim, and Youngmi Kim "Pre-OPC layout decomposition for improved image fidelity", Proc. SPIE 7274, Optical Microlithography XXII, 72742I (16 March 2009); https://doi.org/10.1117/12.816825

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
7 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Optical proximity correction

Photomasks

Resolution enhancement technologies

Semiconducting wafers

Lithography

Optical lithography

Image processing

Show All Keywords

Keywords/Phrases

Search In:

Publication Years