Optical and thermal modeling of ultraviolet-LED array packaging for curing application

Hai Liu; Zirong Tang; Tielin Shi; Guanglan Liao; Lei Nie

doi:10.1117/12.823275

19 February 2009 Optical and thermal modeling of ultraviolet-LED array packaging for curing application

Hai Liu, Zirong Tang, Tielin Shi, Guanglan Liao, Lei Nie

Proceedings Volume 7279, Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration; 72791K (2009) https://doi.org/10.1117/12.823275
Event: Photonics and Optoelectronics Meetings, 2008, Wuhan, China

Abstract

High power Ultraviolet Light-Emitting Diode (UV-LED) is currently in high demand for a variety of applications including lighting, printing, and polymer curing, with its' advantages of durability, reliability, non-hazardous and safety. Recently, the technology of Semiconductor Light Matrix (SLM) by multiple individual LEDs mounted on panels was put forward to obtain higher power for curing application. However, the illumination uniformity of high power LED arrays still remains an issue. On the other hand, it has been also predicted previously that the lifetime of a device decays exponentially as the temperature increases. Therefore, the thermal management of high power LEDs is also a critical factor to the development of high-power UV-LED array light source. This paper presents our latest investigations of illumination uniformity and thermal management to satisfy the requirements of packaging UV-LED arrays for curing application.

Citation Download Citation

Hai Liu, Zirong Tang, Tielin Shi, Guanglan Liao, and Lei Nie "Optical and thermal modeling of ultraviolet-LED array packaging for curing application", Proc. SPIE 7279, Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration, 72791K (19 February 2009); https://doi.org/10.1117/12.823275

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