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Proceedings Article

Optoelectronic packaging based on laser joining

[+] Author Affiliations
Ramona Eberhardt, Erik Beckert, Thomas Burkhardt, Steffen Böhme, Thomas Schreiber, Andreas Tünnermann

Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)

Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800G (February 12, 2008); doi:10.1117/12.763105
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From Conference Volume 6880

  • Laser-based Micro- and Nanopackaging and Assembly II
  • Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako
  • San Jose, CA | January 19, 2008

abstract

Laser based joining technologies for optical assemblies overcome the limitations of standard fixation technologies such as adhesive or wafer level bonding. By applying the laser energy locally and for a limited time these technologies enable for higher stability of optical joints as well as additional functionality. Working without intermediate layers laser splicing creates highly stable transparent joints that are suitable for the transmission of high power, e.g. in fiber laser assemblies. In contrast, laser beam soldering of optical components as an alternative with a metallic intermediate layer is non-transparent, but creates flexible and stress-compensating joints as well as thermal and electrical interconnects.

© (2008) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Ramona Eberhardt ; Erik Beckert ; Thomas Burkhardt ; Steffen Böhme ; Thomas Schreiber, et al.
"Optoelectronic packaging based on laser joining", Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800G (February 12, 2008); doi:10.1117/12.763105; http://dx.doi.org/10.1117/12.763105


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