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Proceedings Article

Low-cost high-density optical parallel link modules and optical backplane for the last 1-meter regime applications

[+] Author Affiliations
Takashi Mikawa

National Institute of Advanced Industrial Science and Technology (Japan)

Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689902 (February 06, 2008); doi:10.1117/12.764197
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From Conference Volume 6899

  • Photonics Packaging, Integration, and Interconnects VIII
  • Alexei L. Glebov; Ray T. Chen
  • San Jose, CA | January 19, 2008

abstract

We describe our R & D on optoelectronic packaging technologies such as the optical backplane utilizing 300 pieces of the high index contrast fine multimode fibers and the low-cost and high-density OE-conversion parallel link modules operating at 10 Gbps /ch for less than 1 m regime applications. Combination of the developed backplane and the modules implies potential of 3 Tbps aggregate throughputs at the board-to-board level optical interconnections. We also introduce novel component technologies for low-cost and high-density optical coupling between optical devices. These technologies include the monolithic two wavelengths twin VCSELs and easy self-alignment coupling technology capable of alleviating difficulties for optics penetration inside the box.

© (2008) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Takashi Mikawa
"Low-cost high-density optical parallel link modules and optical backplane for the last 1-meter regime applications", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689902 (February 06, 2008); doi:10.1117/12.764197; http://dx.doi.org/10.1117/12.764197


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