System-in-package LTCC platform for 3D RF to millimeter wave

T. Vähä-Heikkilä; M. Lahti

doi:10.1117/12.880371

15 April 2011 System-in-package LTCC platform for 3D RF to millimeter wave

T. Vähä-Heikkilä, M. Lahti

Proceedings Volume 7980, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2011; 79800W (2011) https://doi.org/10.1117/12.880371
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2011, San Diego, California, United States

Abstract

This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays.

Citation Download Citation

T. Vähä-Heikkilä and M. Lahti "System-in-package LTCC platform for 3D RF to millimeter wave", Proc. SPIE 7980, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2011, 79800W (15 April 2011); https://doi.org/10.1117/12.880371

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