The purpose of this study is to develop a better understanding of the damage progression in composite materials undergoing tension loading, while pushing the boundaries on measurements to identify material damage. Several SHM methods are used to detect the types of damage that are observed in each test. A Digital Image Correlation system is used to measure the surface strain throughout the test and also the residual strain after each loading cycle. The residual strain is used as an indicator for the presence of damage in the structure. Piezoelectric wafer active sensors (PWAS) are bonded to the composite material and are used to detect damage using Electromechanical Impedance Spectroscopy (EMIS). The EMIS method analyzes the changes in the structural resonances and anti-resonances. The Electrochemical Impedance Spectroscopy (ECIS) method is also used to detect damage. This method uses the impedance of the structure to determine the state of the structure. As the damage progresses in the composite, the impedance across the thickness will change.© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.