For current and future semiconductor technology nodes with critical dimensions of 32 nm or below, the e-beam lithography is faced with increasing challenges to achieve a reasonable patterning of structures, especially if a process with a chemically amplified resist is used. The reasons for these limitations are the physical properties of the transfer process used to print a structure onto the resist-coated substrate, which inherently contains an unavoidable blurring of the deposited e-beam energy around the desired shape. This blurring is usually described by a so called process proximity function (PPF) and mostly approximated by a superposition of two or more Gaussian functions. The PPF includes the e-beam blur, electron forward scattering and resist effects (often described altogether by the so called alpha parameter of the PPF [K. Keil et al, "Resolution and total blur: Correlation and focus-dependencies in e-beam lithography," J. Vac. Sci. Technol. B 27, 2722 (2009)]) as well as the backscattering effect (often described by the so called beta parameter of the PPF). When the desired critical dimensions of structures are near or below the alpha parameter of the PPF, depending on their environment it may be just impossible to print the structures because of the vanishing image contrast. The PPF model confirms this well-known behavior but also shows ways and limits for improvements. This paper provides real pattern lithography results - comparing classical and GIDC correction - for exposures done on a Vistec SB3050DW shaped e-beam writer. A performance comparison of the GIDC method and the classical dose correction in terms of data preparation and writing time is presented.© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.