Paper
1 April 2008 A new robust process window qualification (PWQ) technique to perform systematic defect characterization to enlarge the lithographic process window using a die-to-database verification tool (NGR2100)
Tadashi Kitamura, Toshiaki Hasebe, Kazufumi Kubota, Futoshi Sakai, Shinichi Nakazawa, Michael Hoffman, Masahiro Yamamoto, Masahiro Inoue
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Abstract
A new Robust Process Window Qualification (PWQ) Technique to perform systematic defect characterization to enlarge the Lithographic process window is described, using a Die-to-Database Verification Tool (NGR2100).
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tadashi Kitamura, Toshiaki Hasebe, Kazufumi Kubota, Futoshi Sakai, Shinichi Nakazawa, Michael Hoffman, Masahiro Yamamoto, and Masahiro Inoue "A new robust process window qualification (PWQ) technique to perform systematic defect characterization to enlarge the lithographic process window using a die-to-database verification tool (NGR2100)", Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 692519 (1 April 2008); https://doi.org/10.1117/12.772706
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Cited by 5 patents.
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KEYWORDS
Lithography

Inspection

Optical proximity correction

Defect detection

Bridges

Optical inspection

Scanning electron microscopy

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