New optoelectronic methodology for nondestructive evaluation of MEMS at the wafer level

Cosme Furlong; Curtis F. Ferguson; Michael J. Melson

doi:10.1117/12.515925

26 February 2004 New optoelectronic methodology for nondestructive evaluation of MEMS at the wafer level

Cosme Furlong, Curtis F. Ferguson, Michael J. Melson

Proceedings Volume 5265, Two- and Three-Dimensional Vision Systems for Inspection, Control, and Metrology; (2004) https://doi.org/10.1117/12.515925
Event: Photonics Technologies for Robotics, Automation, and Manufacturing, 2003, Providence, RI, United States

Abstract

One of the approaches to fabrication of MEMS involves surface micromachining to define dies on single crystal silicon wafers, dicing of the wafers to separate the dies, and electronic packaging of the individual dies. Dicing and packaging of MEMS accounts for a large fraction of the fabrication costs, therefore, nondestructive evaluation at the wafer level, before dicing, can have significant implications on improving production yield and costs. In this paper, advances in development of optoelectronic holography (OEH) techniques for nondestructive, noninvasive, full-field of view evaluation of MEMS at the wafer level are described. With OEH techniques, quantitative measurements of shape and deformation of MEMS, as related to their performance and integrity, are obtained with sub-micrometer spatial resolution and nanometer measuring accuracy. To inspect an entire wafer with OEH methodologies, measurements of overlapping regions of interest (ROI) on a wafer are recorded and adjacent ROIs are stitched together through efficient 3D correlation analysis algorithms. Capabilities of the OEH techniques are illustrated with representative applications, including determination of optimal inspection conditions to minimize inspection time while achieving sufficient levels of accuracy and resolution.

Citation Download Citation

Cosme Furlong, Curtis F. Ferguson, and Michael J. Melson "New optoelectronic methodology for nondestructive evaluation of MEMS at the wafer level", Proc. SPIE 5265, Two- and Three-Dimensional Vision Systems for Inspection, Control, and Metrology, (26 February 2004); https://doi.org/10.1117/12.515925

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