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Proceedings Article

Analysis of internal crack propagation in silicon due to permeable pulse laser irradiation: study on processing mechanism of stealth dicing

[+] Author Affiliations
Etsuji Ohmura, Yuta Kawahito

Osaka Univ. (Japan)

Kenshi Fukumitsu, Junji Okuma, Hideki Morita

Hamamatsu Photonics K.K. (Japan)

Proc. SPIE 7996, Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2010, 799603 (February 28, 2011); doi:10.1117/12.887431
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From Conference Volume 7996

  • Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2010
  • Vadim P. Veiko; Tigran A. Vartanyan
  • St. Petersburg, Russian Federation | July 05, 2010

abstract

Stealth dicing (SD) is an innovative dicing method developed by Hamamatsu Photonics K.K. In the SD method, a permeable nanosecond laser is focused inside a silicon wafer and scanned horizontally. A thermal shock wave propagates every pulse toward the side to which the laser is irradiated, then a high dislocation density layer is formed inside the wafer after the thermal shock wave propagation. In our previous study, it was concluded that an internal crack whose initiation is a dislocation is propagated when the thermal shock wave by the next pulse overlaps with this layer partially. In the experimental result, the trace that a crack is progressed gradually step by step was observed. In this study, the possibility of internal crack propagation by laser pulses was investigated. A two-dimensional thermal stress analysis based on the linear fracture mechanics was conducted using the stress distribution obtained by the axisymmetric thermal stress analysis. As a result, the validity of the hypothesis based on a heat transfer analysis result previously presented was supported. Also it was concluded that the internal crack is propagated by at least two pulses.

© (2010) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Etsuji Ohmura ; Yuta Kawahito ; Kenshi Fukumitsu ; Junji Okuma and Hideki Morita
"Analysis of internal crack propagation in silicon due to permeable pulse laser irradiation: study on processing mechanism of stealth dicing", Proc. SPIE 7996, Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2010, 799603 (February 28, 2011); doi:10.1117/12.887431; http://dx.doi.org/10.1117/12.887431


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